TECHNOLOGY
SEMICONDUCTORS
- Process and Characterization Equipments
- Horizontal and Vertical Diffusions Systems, Oxidation, Atmospheric and LPCVD Process Systems
- Photolithography, Mask Aligner Collimated UV Exposure Systems, Spin Coater, Developer, HDMS
- Wet Process Stations, Spin Rinser Dryers, Spray Solvent Tool, Spray Acid Tool
- Automated Defect Detection System, Optical Stylus System for BOW, WRAP Metrology, Non Contact Optical Surface Profiler, Vision Based CD Measurement System
- PECVD, RIE, ICP-RIE System, ICP PECVD, ECR/ Microwave Systems, Deep Silicon Etch
- HV/UHV DC/ RF Magnetron Sputtering Systems, E-Beam And Thermal Evaporation, Plasma , Rapid Thermal Annealing System
- Spectroscopic Ellipsometer
- Laser Pattern Generator
- Hall Effect Measurement System, LED Tester, Probe Station Mannual, Semiautomatic and Fully Automatic
- Instrumentation for Photovoltaic (Spectral Response/QE Measurement System, Small Area Solar Simulator, Solar Cell I-V Tester, I-V Curve Data Acquisition System, Solar Cell Sorter, Spectro Radiometer
- UHV deposition & MBE System or Oxides and Nitrides
- Four Point Probe Systems
- Precision Dicing and Scribing and Grinding Machine
- MOCVD







NANOTECHNOLOGY
- Process, Engineering and Characterization Equipments
- Scanning Probe Microscope (AFM / STM / SNOM)
- Nano Indentation System
- E-Beam, Lithography System
- Nano-Imprint
- Lithography System
Lithography Upgrades for SEMs, Beam Blankers, X-Y stages for SEM - Thermal CVD, LPCVD and PECVD System for CNT, Graphene and 2d Materials
- Non Contact Optical Profiler
- Atomic Layer Deposition System
- Nanpositioning and Nano Measuring Systems
- In-situ Nanocleaning, Nanoindentation, TEM Lamella preparation,IV Charaterteristic, Nanocutting, Nanocladding





MATERIALS
- Packaging Material
Tungsten-copper (WCu, CuW),Heat Sinks, Molybdenum-copper (MoCu, SuMo) Heat Sinks, Cu/Mo70Cu/Cu Heat Sinks, Ceramic RF, Microwave and Power Packages, Molybdenum and Molybdenum Alloys, Tungsten Metal Products and Alloys. - Graphene Material
CVD Graphene Films, Graphene Oxide CVD, Graphene on TEM Grid, Graphene Quantum Dot and Accessories. - Wafers
Si, GaAs, InP, GaP, InSb, InAs, GaSb, GaN Wafers, Germanium, Glass, Quartz, Pyrex, Sapphire, Al, II-VI, ZnSe, ZnO, CdS, CdTe Wfaers, YVO4, TiO2, CaCO3, LiNbO3, LiTaO3 Wafers, SrTiO3, LaAlO3, LSAT, MgO SrLaAlO4 Wafers - Resists
E-beam resist (positive /negative, deep UV) , Photoresists Positive (I-line, g-line),Image reversal resists (I-line, g-line, negative photoresists (deep UV, I-line) - Substrate Single Crystals
For Superconductivity : Al2o3, LaAlo3, Mgo, SrTio3, Nb:Srtio3,YAIo3, Zro2(Y), etc.
Bicrystals : Al2o3, Mgo, Srtio3, Nb: Srtio3, Zro2
For III-V Nitrides : Al2o3, Lialo2, Ligao2, MgAl, ZnO, etc.
Epi-ready polishing of surface with an orientation (standard) and better. - Single Crystals
BaTio3, Coo, Cr2o3, Feo, Fe2o3, Gd3Ga5O12, Mno, Nio, Sio2 , etc.
Polishing of surface with an orientation accuracy form 20 to <0.10 - Pure Elements and Alloys
Ag, Al, As, Au, B, Be, Bi, C, Ca, Cd, Ce, Cc, Eu, Fe, Ga, Ge, hf, Ho, In, Ir, K , La, Li, Lu, Nd, Ni, Os, P, Pb, Pd, Pr, Pt, Rb, Re,Rh, Ru, S, Sn, Sr, Ta , Te, Tb, TL, Th, Tm, Ti, U, V, W , Y, Yb, Pure ingots, tubes, foils, wires, granules, thermo elements etc.
Polishing of surface with an orientation accuracy form 20 to <0.10
Purity from 3N to 7N. - Optical Crystals
AgBr, AgCl, BaF2, CaF2, CdTe, CsI, fused silica, Ge, Kbr, KCI, KRS-5, LiF, MgF2, Sapphire (including tubes), Si, znse Mirrors, Prisms, lenses, windows & wedges with diameter up to 8.5″ - Semiconductor Single Crystals
Electronic grade Ge-and si-wafers(doped and u
II-VI Semiconductors (CdTe, Cds,CdSe, Zns, Zn
III-V Semiconductors (GaAs, GaP, GaSB, InAs, Ir
IV-Vi semiconductors (Pbs,PbSe,PbTe, SnTe. - Sputter Targets
Metal, non-metals and chemical compounds
With purity from 99 to 99.99999%
