TECHNOLOGY

TECHNOLOGY

NANOTECHNOLOGY

• Process, Engineering and Characterization Equipments
• Scanning Probe Microscope (AFM / STM / SNOM)
• Nano Indentation System
• E-Beam, Lithography System
• Nano-Imprint
• Lithography System
  Lithography Upgrades for SEMs, Beam Blankers, X-Y stages for SEM
• Thermal CVD, LPCVD and PECVD System for CNT, Graphene and 2d Materials
• Non Contact Optical Profiler
• Atomic Layer Deposition System
• Nanpositioning and Nano Measuring Systems
• In-situ Nanocleaning, Nanoindentation, TEM Lamella preparation,IV Charaterteristic, Nanocutting, Nanocladding

SEMICONDUCTORS

• Process and Characterization Equipments
• Horizontal and Vertical Diffusions Systems, Oxidation, Atmospheric and LPCVD Process Systems
• Photolithography, Mask Aligner Collimated UV Exposure Systems, Spin Coater, Developer, HDMS
• Wet Process Stations, Spin Rinser Dryers, Spray Solvent Tool, Spray Acid Tool
• Automated Defect Detection System, Optical Stylus System for BOW, WRAP Metrology, Non Contact Optical Surface Profiler, Vision Based CD Measurement System
• PECVD, RIE, ICP-RIE System, ICP PECVD, ECR/ Microwave Systems, Deep Silicon Etch
• HV/UHV DC/ RF Magnetron Sputtering Systems, E-Beam And Thermal Evaporation, Plasma , Rapid Thermal Annealing System
• Spectroscopic Ellipsometer
• Laser Pattern Generator
• Hall Effect Measurement System, LED Tester, Probe Station Mannual, Semiautomatic and Fully Automatic
• Instrumentation for Photovoltaic (Spectral Response/QE Measurement System, Small Area Solar Simulator, Solar Cell I-V Tester, I-V Curve Data Acquisition System, Solar Cell Sorter, Spectro Radiometer
• UHV deposition & MBE System or Oxides and Nitrides
• Four Point Probe Systems
• Precision Dicing and Scribing and Grinding Machine
• MOCVD

PHOTONICS

• Optical Components, Opto-Mechanical Components, Crystals, Laser Line Components, Nanopositioning
• Monochromators / Spectrographs, CCD Camera, Detectors, Photoluminescence, Raman Systems

MATERIALS

• Packaging Material
  Tungsten-copper (WCu, CuW),Heat Sinks, Molybdenum-copper (MoCu, SuMo) Heat Sinks, Cu/Mo70Cu/Cu Heat Sinks, Ceramic RF, Microwave and Power Packages, Molybdenum and Molybdenum Alloys, Tungsten Metal Products and Alloys.
• Graphene Material
  CVD Graphene Films, Graphene Oxide CVD, Graphene on TEM Grid, Graphene Quantum Dot and Accessories.
• Wafers
  Si, GaAs, InP, GaP, InSb, InAs, GaSb, GaN Wafers, Germanium, Glass, Quartz, Pyrex, Sapphire, Al, II-VI, ZnSe, ZnO, CdS, CdTe Wfaers, YVO4, TiO2, CaCO3, LiNbO3, LiTaO3 Wafers, SrTiO3, LaAlO3, LSAT, MgO SrLaAlO4 Wafers
• Resists
  E-beam resist (positive /negative, deep UV) , Photoresists Positive (I-line, g-line),Image reversal resists (I-line, g-line, negative photoresists (deep UV, I-line)
• Substrate Single Crystals
  For Superconductivity : Al2o3,  LaAlo3,  Mgo,  SrTio3, Nb:Srtio3,YAIo3, Zro2(Y), etc. 
  Bicrystals : Al2o3, Mgo,  Srtio3,  Nb: Srtio3,  Zro2
  For III-V Nitrides : Al2o3,  Lialo2, Ligao2,  MgAl,  ZnO, etc.
  Epi-ready polishing of surface with an orientation (standard) and better.
• Single Crystals
  BaTio3, Coo, Cr2o3, Feo, Fe2o3, Gd3Ga5O12, Mno, Nio, Sio2 , etc.
  Polishing of surface with an orientation accuracy form 20 to <0.10
• Pure Elements and Alloys
  Ag, Al, As, Au, B, Be, Bi, C, Ca, Cd, Ce, Cc, Eu, Fe, Ga, Ge, hf, Ho, In, Ir, K , La, Li, Lu, Nd, Ni, Os, P, Pb, Pd, Pr, Pt, Rb, Re,Rh, Ru, S, Sn, Sr, Ta , Te, Tb, TL, Th, Tm, Ti, U, V, W , Y, Yb, Pure ingots, tubes, foils, wires, granules, thermo elements etc.
  Polishing of surface with an orientation accuracy form 20 to <0.10
  Purity from 3N to 7N.
•  Optical Crystals
  AgBr, AgCl, BaF2, CaF2, CdTe, CsI, fused silica, Ge, Kbr, KCI, KRS-5, LiF, MgF2, Sapphire (including tubes), Si, znse Mirrors, Prisms, lenses, windows & wedges with diameter up to 8.5″
• Semiconductor Single Crystals
  Electronic grade Ge-and si-wafers(doped and u 
  II-VI Semiconductors (CdTe, Cds,CdSe, Zns, Zn
  III-V Semiconductors (GaAs, GaP, GaSB, InAs, Ir
  IV-Vi semiconductors (Pbs,PbSe,PbTe, SnTe.
• Sputter Targets
  Metal, non-metals and chemical compounds
  With purity from 99 to 99.99999%

3D METAL PRINTERS (SLM/DMLS)

• Laser Power of 250 W / 500 W / 1 kW
• Building Platform of size 150 mm X 150mm to 1250 X 1250 mm for different sized parts & designs.
• For various metallic powders and alloys like Cobalt Chromium CoCr, Titanium, Aluminium, Stainless Steel, Alloy Steel, Nickle based alloys etc

INDUSTRIAL LASER SYSTEMS

• Fibre Laser Cutting Machine(1kW to 12kW)
• Manual Laser Welding Machine
• Handheld Laser Welding Machine
• Automated Laser Welding Machine
• Laser Material Depositon