TECHNOLOGY

SEMICONDUCTORS

Process and Characterization Equipments
Horizontal and Vertical Diffusions Systems, Oxidation, Atmospheric and LPCVD Process Systems
Photolithography, Mask Aligner Collimated UV Exposure Systems, Spin Coater, Developer, HDMS
Wet Process Stations, Spin Rinser Dryers, Spray Solvent Tool, Spray Acid Tool
Automated Defect Detection System, Optical Stylus System for BOW, WRAP Metrology, Non Contact Optical Surface Profiler, Vision Based CD Measurement System
PECVD, RIE, ICP-RIE System, ICP PECVD, ECR/ Microwave Systems, Deep Silicon Etch
HV/UHV DC/ RF Magnetron Sputtering Systems, E-Beam And Thermal Evaporation, Plasma , Rapid Thermal Annealing System
Spectroscopic Ellipsometer
Laser Pattern Generator
Hall Effect Measurement System, LED Tester, Probe Station Mannual, Semiautomatic and Fully Automatic
Instrumentation for Photovoltaic (Spectral Response/QE Measurement System, Small Area Solar Simulator, Solar Cell I-V Tester, I-V Curve Data Acquisition System, Solar Cell Sorter, Spectro Radiometer
UHV deposition & MBE System or Oxides and Nitrides
Four Point Probe Systems
Precision Dicing and Scribing and Grinding Machine
MOCVD

NANOTECHNOLOGY

Process, Engineering and Characterization Equipments
Scanning Probe Microscope (AFM / STM / SNOM)
Nano Indentation System
E-Beam, Lithography System
Nano-Imprint
Lithography System
Lithography Upgrades for SEMs, Beam Blankers, X-Y stages for SEM
Thermal CVD, LPCVD and PECVD System for CNT, Graphene and 2d Materials
Non Contact Optical Profiler
Atomic Layer Deposition System
Nanpositioning and Nano Measuring Systems
In-situ Nanocleaning, Nanoindentation, TEM Lamella preparation,IV Charaterteristic, Nanocutting, Nanocladding

MATERIALS

Packaging Material
Tungsten-copper (WCu, CuW),Heat Sinks, Molybdenum-copper (MoCu, SuMo) Heat Sinks, Cu/Mo70Cu/Cu Heat Sinks, Ceramic RF, Microwave and Power Packages, Molybdenum and Molybdenum Alloys, Tungsten Metal Products and Alloys.
Graphene Material
CVD Graphene Films, Graphene Oxide CVD, Graphene on TEM Grid, Graphene Quantum Dot and Accessories.
Wafers
Si, GaAs, InP, GaP, InSb, InAs, GaSb, GaN Wafers, Germanium, Glass, Quartz, Pyrex, Sapphire, Al, II-VI, ZnSe, ZnO, CdS, CdTe Wfaers, YVO4, TiO2, CaCO3, LiNbO3, LiTaO3 Wafers, SrTiO3, LaAlO3, LSAT, MgO SrLaAlO4 Wafers
Resists
E-beam resist (positive /negative, deep UV) , Photoresists Positive (I-line, g-line),Image reversal resists (I-line, g-line, negative photoresists (deep UV, I-line)
Substrate Single Crystals
For Superconductivity : Al2o3, LaAlo3, Mgo, SrTio3, Nb:Srtio3,YAIo3, Zro2(Y), etc.
Bicrystals : Al2o3, Mgo, Srtio3, Nb: Srtio3, Zro2
For III-V Nitrides : Al2o3, Lialo2, Ligao2, MgAl, ZnO, etc.
Epi-ready polishing of surface with an orientation (standard) and better.
Single Crystals
BaTio3, Coo, Cr2o3, Feo, Fe2o3, Gd3Ga5O12, Mno, Nio, Sio2 , etc.
Polishing of surface with an orientation accuracy form 20 to <0.10
Pure Elements and Alloys
Ag, Al, As, Au, B, Be, Bi, C, Ca, Cd, Ce, Cc, Eu, Fe, Ga, Ge, hf, Ho, In, Ir, K , La, Li, Lu, Nd, Ni, Os, P, Pb, Pd, Pr, Pt, Rb, Re,Rh, Ru, S, Sn, Sr, Ta , Te, Tb, TL, Th, Tm, Ti, U, V, W , Y, Yb, Pure ingots, tubes, foils, wires, granules, thermo elements etc.
Polishing of surface with an orientation accuracy form 20 to <0.10
Purity from 3N to 7N.
Optical Crystals
AgBr, AgCl, BaF2, CaF2, CdTe, CsI, fused silica, Ge, Kbr, KCI, KRS-5, LiF, MgF2, Sapphire (including tubes), Si, znse Mirrors, Prisms, lenses, windows & wedges with diameter up to 8.5″
Semiconductor Single Crystals
Electronic grade Ge-and si-wafers(doped and u
II-VI Semiconductors (CdTe, Cds,CdSe, Zns, Zn
III-V Semiconductors (GaAs, GaP, GaSB, InAs, Ir
IV-Vi semiconductors (Pbs,PbSe,PbTe, SnTe.
Sputter Targets
Metal, non-metals and chemical compounds
With purity from 99 to 99.99999%