Solar PV Cell & Ingot

PVA TePla

 Floatzone (FZ) Method 

Thermco Systems

Thermco Horizontal Oxidation and Diffusion Furnace, Semithermo Vertical Diffusion Furnace: These systems support atmospheric and LPCVD processes. Complementing these are T-Clean Wet Chemical Solutions for applications such as porous silicon formation, quartz tube cleaning, and semiconductor/solar wet bench solutions, providing comprehensive semiconductor cleaning systems.

Inline Process Control:

  • Carrier Lifetime (µ-PCD, QSS-µPCD)

  • Color Measurement for Cells

  • Photoluminescence Imaging

  • Sheet Resistance Measurement

  • Single-Wave Ellipsometry

  • Spectroscopic Ellipsometry

  • Thickness and Resistivity Measurement

Laboratory Applications:

  • Deep Level Transient Spectroscopy – PV

  • Light Beam Induced Current

  • Non-Contact C-V Profiling

  • Quasi Steady State – µPCD

Offline Process Control:

  • Carrier Lifetime (µ-PCD, QSS-µPCD)

  • Four Point Probe Sheet Resistance

  • Photoluminescence Imaging

  • Sheet Resistance Measurement

  • Single-Wave Ellipsometry

SI Ingot/Block Testing:

  • Blocks’ Photoluminescence Imaging

  • Bulk Resistivity Measurement

  • E-PCD Carrier Lifetime for Mono-Si

  • Infrared Block Imaging

  • P/N Type Determination

  • µ-PCD Carrier Lifetime for Multi-Si

SI Wafer Sorting

  • Geometry Inspection

  • Microcrack Inspection

  • Photoluminescence Imaging

  • Saw Mark Inspection

  • Surface-Contamination and Chipping Inspection

  • Thickness and Resistivity Measurement

  • µ-PCD Carrier Lifetime for Wafers

Thin Film Applications

  • Four Point Probe Sheet Resistance

  • Spectroscopic Ellipsometry (LTPS)

  • TCO Sheet Resistance

  • Visual Inspectio

Toho Technology

Thin film stress Measurement System, ECV Profiler

Ag Paste

Engineered for Modern Solar Technologies: Available in formulations tailored for TOPCon, HJT, and PERC cell architectures

Customizable Performance: Designed to meet varied electrical, adhesion, and printing requirements based on customer needs.

Reliable Manufacturing Standards: Produced in facilities operating under ISO 9001 and ISO 14001 compliant systems.

PVA TePla

 Floatzone (FZ) Method 

Thermco Systems

Thermco Horizontal Oxidation and Diffusion Furnace, Semithermo Vertical Diffusion Furnace: These systems support atmospheric and LPCVD processes. Complementing these are T-Clean Wet Chemical Solutions for applications such as porous silicon formation, quartz tube cleaning, and semiconductor/solar wet bench solutions, providing comprehensive semiconductor cleaning systems.

Semilab

Inline Process Control:

  • Carrier Lifetime (µ-PCD, QSS-µPCD)

  • Color Measurement for Cells

  • Photoluminescence Imaging

  • Sheet Resistance Measurement

  • Single-Wave Ellipsometry

  • Spectroscopic Ellipsometry

  • Thickness and Resistivity Measurement

Laboratory Applications:

  • Deep Level Transient Spectroscopy – PV

  • Light Beam Induced Current

  • Non-Contact C-V Profiling

  • Quasi Steady State – µPCD

Offline Process Control:

  • Carrier Lifetime (µ-PCD, QSS-µPCD)

  • Four Point Probe Sheet Resistance

  • Photoluminescence Imaging

  • Sheet Resistance Measurement

  • Single-Wave Ellipsometry

SI Ingot/Block Testing:

  • Blocks’ Photoluminescence Imaging

  • Bulk Resistivity Measurement

  • E-PCD Carrier Lifetime for Mono-Si

  • Infrared Block Imaging

  • P/N Type Determination

  • µ-PCD Carrier Lifetime for Multi-Si

SI Wafer Sorting:

  • Geometry Inspection

  • Microcrack Inspection

  • Photoluminescence Imaging

  • Saw Mark Inspection

  • Surface-Contamination and Chipping Inspection

  • Thickness and Resistivity Measurement

  • µ-PCD Carrier Lifetime for Wafers

Thin Film Applications:

  • Four Point Probe Sheet Resistance

  • Spectroscopic Ellipsometry (LTPS)

  • TCO Sheet Resistance

  • Visual Inspection

Toho Technology​

Thin film stress Measurement System, ECV Profiler

Ag Paste

Engineered for Modern Solar Technologies: Available in formulations tailored for TOPCon, HJT, and PERC cell

architecturesCustomizable Performance: Designed to meet varied electrical, adhesion, and printing requirements based on customer needs.

Reliable Manufacturing Standards: Produced in facilities operating under ISO 9001 and ISO 14001 compliant systems.